Infineon Technologies is playing a central role in shaping the software-defined vehicle (SDV) architecture of BMW Group’s next-generation Neue Klasse platform.
Designed to redefine premium electric vehicles, BMW’s Neue Klasse combines electrification, digitalisation and sustainability under a completely reimagined electrical/electronic (E/E) architecture. At the heart of this transformation are Infineon’s high-performance semiconductors, delivering the computing power, connectivity and intelligent power management required for next-generation EVs.
The first model built on the new platform, the BMW iX3, showcases how this partnership translates into real-world performance, efficiency and over-the-air flexibility.
A Software-Defined Platform Built for the Future
The Neue Klasse introduces a scalable and adaptable zonal E/E architecture — a key requirement for true software-defined vehicles.
Infineon provides a comprehensive semiconductor portfolio for the platform, including:
- AURIX and TRAVEO microcontrollers for high-performance and safety-critical processing
- BRIGHTLANE Ethernet solutions for high-speed, low-latency data transfer
- OPTIREG power management ICs for efficient voltage regulation
- PROFET smart power switches and eFuses for intelligent energy distribution
By decoupling software from hardware, BMW can roll out new features and performance upgrades via software-over-the-air (SOTA) updates — without physical hardware changes. For drivers in markets like the UK, Germany and the US, this means vehicles that improve over time and adapt quickly to evolving regulations and customer demands.
The “Heart of Joy”: Centralised High-Performance Computing
At the core of the Neue Klasse are four powerful central computing units — referred to as “Superbrains”.
One of these, the “Heart of Joy”, governs driving dynamics including acceleration, braking and steering within a single high-speed control unit. Built around Infineon’s latest-generation AURIX TC4D microcontroller, the system delivers faster data processing, reduced latency, more responsive handling and smoother vehicle dynamics.
The result is a more engaging and refined driving experience — while also enhancing regenerative braking efficiency to extend range.
High-speed BRIGHTLANE Ethernet ensures seamless communication between the “Heart of Joy” and the vehicle’s other computing domains, including automated driving, infotainment and core vehicle operations.
Smarter Zonal Architecture = Lighter and More Efficient EVs
Beyond computing performance, the Neue Klasse architecture brings significant physical efficiency gains.
Thanks to its zonal design:
– The wiring harness in the BMW iX3 is approximately 600 metres shorter
– Overall wiring weight is reduced by around 30%
For EVs, weight reduction directly translates into improved range and efficiency.
Additionally, Infineon’s PROFET Wire Guard eFuses replace up to 150 traditional fuses per vehicle. These smart eFuses enable software-controlled power management, dynamically switching off non-essential systems depending on vehicle state (charging, driving, parked or updating).
This intelligent power distribution can improve energy efficiency by around 20%, further boosting real-world EV performance.
Strengthening Leadership in Automotive Semiconductors
Infineon has been the global market leader in automotive semiconductors since 2020. Its position in the SDV space was further strengthened by the 2025 acquisition of Marvell Technology’s automotive Ethernet business — a strategic move aimed at accelerating high-speed in-vehicle networking.
Ethernet is now a critical backbone for software-defined vehicles, enabling autonomous driving functions, real-time system coordination and seamless over-the-air updates.
As EV adoption accelerates across Europe and North America, semiconductor innovation is becoming just as important as battery chemistry and motor design. The BMW Neue Klasse platform demonstrates how advanced chip technology is redefining what electric vehicles can deliver.
[source: Infineon]
